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Unisem (M) Berhad (UNISEM) is a semiconductor packaging and test services provider in Malaysia. The Company offers integrated suite of packaging and test services, such as wafer bumping, wafer probing, wafer grinding, as well as range of lead frame and substrate integrated circuits packaging, wafer level chipscale packaging and radio frequency, analog, digital and mixed-signal test services. Its turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. The Companys direct subsidiaries are Unisem II Sdn. Bhd., Unisem Advanced Technologies Sdn. Bhd., Unisem (Europe) Holdings Limited, Unisem Chengdu Co., Ltd., Unisem (Mauritius) Holdings Limited and Unisem International (Chengdu) Ltd. Operations are carried out in Malaysia, the United Kingdom, the Peoples Republic of China, Indonesia and United States of America.
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